OTD (ORV3 Transport Deck)
Emcor Enclosures solves remote integration challenges with a shock and vibration pallet design to mitigate the risk of transporting complete systems.
Emcor Enclosures solves remote integration challenges with a shock and vibration pallet design to mitigate the risk of transporting complete systems.
Emcor Enclosures solves remote integration challenges with a shock and vibration pallet design to mitigate the risk of transporting complete systems.
Emcor Enclosures solves remote integration challenges with a shock and vibration pallet design to mitigate the risk of transporting complete systems.
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Emcor's Tradition Data & Open Compute Project (OCP) Compliant Solutions Available with Accessories & Modifications

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Emcor Enclosures solves remote integration challenges with a shock and vibration pallet design to mitigate the risk of transporting complete systems.
High-strength OCP ORV3 Shock and Vibration Pallet by Emcor, featuring isolators, leveling feet, and lift assembly for stable transport of fully integrated racks and enclosures.
Comparison of foam-based versus isolated shock pallet performance in a 6-inch drop test, showing reduced peak and RMS acceleration for superior vibration isolation.
Emcor Enclosures solves remote integration challenges with a shock and vibration pallet design to mitigate the risk of transporting complete systems.
High-strength OCP ORV3 Shock and Vibration Pallet by Emcor, featuring isolators, leveling feet, and lift assembly for stable transport of fully integrated racks and enclosures.
Comparison of foam-based versus isolated shock pallet performance in a 6-inch drop test, showing reduced peak and RMS acceleration for superior vibration isolation.

OTD (ORV3 Transport Deck)

Developed for the Open Compute Project (OCP) architecture, the patented (US Patent No. US 10343814 B2) Emcor ORV3 Transport Deck (OTD) Shock and Vibration Pallet provides the stability and precision required for modern hyperscale and critical supercompute systems. Designed to interface directly with OCP-compliant rack frames, this rugged steel platform ensures secure transport of fully integrated enclosures while minimizing shock and vibration. The pallet’s integrated lift assembly and threaded leveling feet simplify handling and installation, enabling repeat deployment without structural fatigue. Each unit incorporates heavy-duty isolators and reinforced mounting points that maintain payload integrity through the rigors of overland transit. Built to the same standards that define Emcor’s legacy of reliability, this reusable pallet supports sustainable, mission-ready logistics for moludar and scalable data center applications. The result is a platform that delivers both flexibility and peace of mind—ready for integration wherever your system goes.

Out-Performing Traditional Packaging

Discover how Emcor’s isolated shock pallet outperforms traditional foam packaging in real-world impact testing. This quick comparison shows a dramatic reduction in peak and RMS acceleration, proving how advanced vibration isolation technology better protects sensitive electronics during transport. See the data behind the performance difference.

Need a Pallet Modified?

Our engineers have developed a series of assemblies to accommodate our own standards, but we can deliver modified and custom solutions. Call us to answer a few questions and start your project today – 507-287-3535.

Why Choose Emcor for OCP Deployments?

With decades of experience supporting defense, data center, and industrial clients, Emcor delivers enclosures that are rugged, reliable, and responsive to your needs. All engineering and manufacturing is done in the U.S., with fast lead times and the ability to scale from prototype to full production. Need a modified enclosure that actually fits your system? Emcor delivers—on time, and built to perform. We offer design services and solutions to meet the needs of any product specification.  Whether you need a cabinet to house your electronic measurement equipment or a heavy-duty cabinet for data storage, you can count on our expert resources and engineering capabilities to support any stage of your 10 Series project, from concept to production. Contact us with your requirement today.

Features

OTD Technical Specifications

    • U.S. Patent No.: US 10343814 B2

    • Product Type: OCP Shock and Vibration Pallet Assembly

    • Compatibility: Designed for OCP (Open Compute Project) ORV3 racks and enclosures

    • Material: Heavy-gauge steel, painted finish

    • Dimensions (Reference):

      • Width: 1071.0 mm (42.17 in)

      • Depth: 1049.3 mm (41.32 in)

      • Height: 215.9 mm (8.50 in)

      • Additional ref. dims: 108.0 mm, 82.6 mm, 355.6 mm

    • Shock Isolation: Utilizes M22-400-08-A isolators (4 ea)

    • Mounting: Includes OCP lift assembly and OCP foot interfaces for standardized ORV3 alignment

    • Welding Standard: Conforms to ES-166

    • Fasteners and Hardware: High-strength steel screws, washers, and lock components

 

OTD Features

  • Purpose-built for OCP ORV3 racks to ensure mechanical compatibility with open frame and integrated data center systems

  • Integrated OCP lift assembly for safe handling and installation of fully populated racks

  • Threaded leveling feet (M20 × 2.5) with M10 recessed drive enable precise stabilization on uneven surfaces

  • Four heavy-duty isolators minimize shock and vibration transmission during overland transport

  • Painted steel construction for durability and corrosion resistance in repeated deployment cycles

  • Configurable mounting geometry to support both OCP standard and custom payloads

  • Reusable pallet design for sustainable deployment of IT or defense electronics

  • Engineered and manufactured in the USA under Emcor’s precision fabrication standards

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